BRIGHTON, U.K. – Fiat Chrysler is part of a European Union-backed automotive industry research project whose goal is to boost circuit technology within vehicles, transforming lighting and infotainment solutions while boosting overall performance.
The €7.5 million ($8.2 million) TERASEL project is drawing plaudits for developing so-called smart free-form 2.5D electronic and sensor circuits that are reshaped from the standard flat-plane shape to a desired 2.5D form using conventional thermoforming processes.
These circuits can be used for seamless, low-cost and energy-efficient electronic applications, says project coordinator Jan Vanfleteren at Ghent University’s Center for Microsystems Technology in Belgium. He expects his team to complete its work by September.
TERASEL’s goal is to establish near-to-production industrial value chains, working in conjunction with scientists from the automotive and other industries.
Such advanced new circuitry could have price and quality implications, not only by improving lighting systems and infotainment but also cutting manufacturing costs by reducing requirements for expensive traditional raw materials.
Officials at trade groups such as ACEA, the European automakers’ organization, and the U.K.’s Society of Motor Manufacturers and Traders tell WardsAuto this could help meet increasing demand challenges both for low-cost vehicles in Eastern Europe and ever-better infotainment and leading-edge technology in richer countries’ car markets.
“We think our technology has advantages – cost, performance – over competing technologies like 3D-MID and flex-rigid boards,” Vanfleteren says. “We produce the circuit on a flat temporary carrier with standard flexible-circuit manufacturing technologies and then test and repair the circuit.
“We embed the flat circuit in a thermoplastic polymer and thermoform the circuit from flat to final 3D shape. This can be done thanks to meander-shaped extensible copper electrical interconnections.”
He describes the potential benefits to the auto industry as “cost-effective integration of sensor and electronic functions on or in curved automotive interior surfaces allowing space and weight reduction, more appealing designs and added functionality.
Challenges remain, however, including the problem of combining this technology with overmolding to verify that automotive reliability specifications can be achieved,” Vanfleteren says. “This is an ongoing activity for the project.”
In the future, the trend toward high-tech components is increasing the demand for multi-layer printed circuit boards and so-called HDI microvia interconnections between high-density circuit-board substrates, Vanfleteren says. “Boosting efficiency and delivering top-quality standards are major issues in this line of business.
“We focus on the issues of safety, information, environment, e-mobility and affordable cars.”
Creating Atmosphere
His colleague at Ghent, Frederick Bossuyt, says: “The advantages are that you get rid of a lot of mechanical parts, such as the knobs on radios or GPS, so that you get a reduction in complexity and an increase in reliability. The main applications are in lighting and infotainment. You can definitely create atmosphere in your car because of the different surfaces.”
Asked how long it would be before the technology would become industry-standard, Bossuyt answers, “Although some manufacturers are already displaying similar technologies at motor shows, it will be a couple of years before you will see it in most new cars.”
Among TERASEL’s project partners is Fiat R&D division Centro Ricerche Fiat, based in Turin, Italy, which is helping develop the new smart circuits and advising on industry applications.
Commenting on research into auto circuitry in general, a spokesman for the SMMT says, “Key areas being developed include intelligent transport systems (ITS) which allow vehicle-to-vehicle and vehicle-to-infrastructure communication in order to reduce road accidents, relieve congestion and reduce emissions.”
Key ITS applications include traffic management and control systems, electronic toll collection and route-navigation systems, the spokesman says.
Another technology being developed that aims to improve road safety is intelligent speed adaptation. These systems inform the driver of the speed limit for the road on which they are traveling and automatically reduce the speed of the vehicle.
An official ACEA member must invest more than €32 billion ($34.9 billion) per year in R&D, and the group encourages manufacturers to pool resources. The association supports efforts to develop new electrical components as they are necessary to reduce carbon-dioxide emissions and to install energy-recuperation systems. Also, solutions using less copper than those common in high-end entertainment systems help meet demand for low-cost autos in less-affluent nations.
The trade group predicts the number of applications for entertainment, infotainment and navigation will increase in mature markets. The potential for simplification is huge, with multiple electronic components integrated in the driver’s cockpit. “The need for more sophisticated circuit boards is pushed by a growing share of consumer-focused features such as GPS, Bluetooth and DVD,” an ACEA note says.
Private partners in the project include high-technology companies and developers as well as manufacturers and consultancies from across Western and Northern Europe.
